Calculates the disperible power by an heatsink obtained directly
on the PCB with variable dimensions and shape.
This kind of heatsink is adapt to treat low powers and is indispensable for
components with only solder terminals.
°C
°C
Exposed surface
cm2
| Results | |||
| Thermic resistance of the heatsink | °C/W | ||
| Maximum dispersible power | W | ||
| Index of utilization of surfaces | % | ||
Notes.
Calculation refers to glass-fiber supports with copper plating of standard thickness,
for bakelite supports the result is downgraded.
The heatsink must be electric insulated to allow the direct contact of the heating
element with the heatsink itself, in some case is the component solder that transfers
the heat (example diodes or power resistance).
The heatsink shape has got a great influence caused by the real low thickness of
copper avaible, for a better efficiency the heating element must be placed at
the center of the avaible surface.
Pay attention on setting the ambience temperature, for ambience temperature means
the working temperature of the PCB that is subjected at the induced heating of the
components themselves.
Applications for thermal dissipation.
